HK IPOAIHong Kong IPO intelligence

SICC

02631A+HListed

半導體 · 公司专注于碳化硅衬底的研发与产业化,是全球领先的宽禁带半导体材料制造商。

Neutral
71.9
/100
Offer price
HK$42.80
Final offer price
HK$42.80
Lot / entry fee
100 shares · HK$4K
Proceeds
HK$2.04B
Sponsor
CICC / CITIC Securities
Est. margin oversub.
2439.4x
Public oversub.
2809.2x
One-lot win rate
30.0%
First-day return
+6.4%
Offer starts
Aug 11
Offer closes
Aug 14
Grey market
Aug 19
Listing
Aug 20

AI reference scoring and scenarios

After grey market
After grey market L1 heat score
71.9/ 100
Data coverage Mid-high
Target
Prior calibration
Listing-day trend
Neutral-positivePartial basis
Up probability
68.0%
First-day reference range
+6.2% – +23.0%
Published outcome check
First-day resultUp+6.4%
Our call: Trend call valid
Covered 19/25 core factors
UsedMissingNot yet scorableN/A
Margin oversubscription
High heat
Offer size
Weaker quality
Cornerstone lockup
Average support
Post-lockup offer value
Weak scarcity
Recent same-rule trend
Recent same-type trend
Recent sector trend
Valuation
Weak appeal
Fundamental quality
Average quality
Growth quality
High quality
Profitability
Weak quality
Cash runway
Customer concentration
High risk
Cornerstone quality
Strong support
Sponsor record
Strong record
Greenshoe arrangementGreenshoe: yes · 15%
Average support
Stabilizer track record
A-share pre-grey trend
Strong trend
A-share listing-day trend
Strong trend
Public oversubscription
High heat
One-lot win rate
Weak heat
International placing
High heat
Final pricing position
Actual greenshoe useCumulative use +2.5%
Average support
Grey market return
Strong trend

The assessment and probability ranges are informational only and are not investment advice.

AI Research Report

After grey market
The analysis report for this IPO is being generated.